METHOD OF FORMING DIELECTRIC LAYERS WITH LOW DIELECTRIC CONSTANTS
摘要
A method (100) of depositing a dielectric material includes providing (101) a substrate with at least one layer over the substrate. The method further includes pre-wetting (102) a top surface of a top layer with a substance, spin coating (103) the solution and forming (104) the dielectric material. The dielectric material is illustratively SiO2 that is relatively porous, and has a relatively low dielectric constant. The pre-wetting results in a reduction in processing costs due to a reduction in lost solution. Moreover, the dielectric layer (209) has an improved thickness uniformity.
申请公布号
WO2005029567(A1)
申请公布日期
2005.03.31
申请号
WO2004IB51793
申请日期
2004.09.18
申请人
KONINKLIJKE PHILIPS ELECTRONICS, N.V.;SACHDEV, HARBANS;LEUNG, GARKAY;RAPP, JOHN;MATERA-LONGO, MARY;SARMA, NARA;MEISNER, STEPHEN
发明人
SACHDEV, HARBANS;LEUNG, GARKAY;RAPP, JOHN;MATERA-LONGO, MARY;SARMA, NARA;MEISNER, STEPHEN