| 摘要 |
PROBLEM TO BE SOLVED: To provide a reduced-pressure drying device which is capable of automatically removing a trapped solvent and operating continuously, to provide a reduced-pressure drying method, and to provide a trapping device which is capable of automatically removing trapped liquid. SOLUTION: A solvent vapor, volatilized from a coating film while a wafer W, is subjected to a reduced pressure drying process is liquified and trapped by a trapping member 31 provided at the middle of the exhaust path 5, then the trapping member 31 is moved to the side of a drainage chamber 32 and then made to pivot so as to shake off the droplets of solvent, and the solvent is discharged out by suction through a suction path 45. These processes are carried out automatically and continuously. COPYRIGHT: (C)2005,JPO&NCIPI
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