COATED METAL STUD BUMP FORMED BY A COATED WIRE FOR FLIP CHIP

摘要

A method for forming a stud bumped semiconductor die is disclosed. The method includes forming a ball (18 and 19) at the tip of a coated wire (21) passing through a hole in a capillary (22), where the coated wire has a core (19) and an oxidation-resistant coating (18). The formed ball is pressed to the conductive region (2) on the semiconductor die (1). The coated wire is cut (Fig. 7), thereby leaving a conductive stud bump on the conductive region, where the conductive stud bump includes an inner conductive portion (19) and an outer oxidation-resistant layer (18).