发明名称 MOISTURE-PROOF PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive moisture-proof packaging material which is excellent in piercing resistance, moisture-proof property, and antistatic property, and suitable for packaging electronic components. SOLUTION: The moisture-proof packaging material consists of an outer layer in which a base film and a metal foil are laminated by an extrusion-laminate method, and a heat seal layer to be laminated on the metal foil side of the outer layer by a dry-laminate method. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005082180(A) 申请公布日期 2005.03.31
申请号 JP20030314802 申请日期 2003.09.05
申请人 KYODO PRINTING CO LTD 发明人 OGAWA TATSUYA;KOIZUMI SHINICHI;TAKAHASHI SAORI;CHIBA EISUKE
分类号 B65D65/40;B32B15/08;(IPC1-7):B65D65/40 主分类号 B65D65/40
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