发明名称 POWER SUPPLY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a power supply device 11 enabled to reduce consumption of sealing resin material 30 and weight. SOLUTION: A circuit board 25 and at least conductive parts 29 of electric components 26 are accommodated in an inner housing 16. Sealing with resin of the circuit board 25 and at least the conductive parts 29 of the electric components 26 is performed by the sealing resin material 30 while electrical component bodies 27 of the electric components 26 are exposed inside the inner housing 16. The inner housing 16 is accommodated in an outer housing 13. Sealing with resin is performed by the inner housing 16, to only the circuit board 25 and at least the conductive parts 29 of the electric components 26 to which sealing with resin is necessary. As a result, consumption of the sealing resin material 30 and weight are reduced. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005086116(A) 申请公布日期 2005.03.31
申请号 JP20030319142 申请日期 2003.09.11
申请人 TOSHIBA LIGHTING & TECHNOLOGY CORP;WAKO DENKI KK 发明人 KAMATA MASAHIKO;SUZUKI HIROSHI;HIRAOKA TOSHIYUKI;MITA KAZUTOSHI;SATO KAZUHIKO
分类号 H05K5/00;H05K5/02;(IPC1-7):H05K5/00 主分类号 H05K5/00
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