摘要 |
PROBLEM TO BE SOLVED: To provide a power supply device 11 enabled to reduce consumption of sealing resin material 30 and weight. SOLUTION: A circuit board 25 and at least conductive parts 29 of electric components 26 are accommodated in an inner housing 16. Sealing with resin of the circuit board 25 and at least the conductive parts 29 of the electric components 26 is performed by the sealing resin material 30 while electrical component bodies 27 of the electric components 26 are exposed inside the inner housing 16. The inner housing 16 is accommodated in an outer housing 13. Sealing with resin is performed by the inner housing 16, to only the circuit board 25 and at least the conductive parts 29 of the electric components 26 to which sealing with resin is necessary. As a result, consumption of the sealing resin material 30 and weight are reduced. COPYRIGHT: (C)2005,JPO&NCIPI
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