发明名称 |
Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit |
摘要 |
Methods and apparatus for performing a wire-bonding operation in an integrated circuit are disclosed. The positions of at least one height-sensing pad and at least one bond pad are determined on a top surface of an integrated circuit die. The height-sensing pad is electrically isolated from the die circuitry and the bond pad is electrically connected to the die circuitry. A bonding tool is lowered to the height-sensing pad, and a height coordinate of the height-sensing pad is then determined. Finally, the bond pad is wire-bonded to a leadframe utilizing the height coordinate of the height-sensing pad.
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申请公布号 |
US2005067678(A1) |
申请公布日期 |
2005.03.31 |
申请号 |
US20030673703 |
申请日期 |
2003.09.29 |
申请人 |
LIAN SEAN;RYAN VIVIAN;YENCHO DEBRA LOUISE |
发明人 |
LIAN SEAN;RYAN VIVIAN;YENCHO DEBRA LOUISE |
分类号 |
H01L21/607;H01L21/66;(IPC1-7):H01L23/495;H01L21/44 |
主分类号 |
H01L21/607 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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