INTERPOSER AND MULTILAYER PRINTED WIRING BOARD

摘要

Disclosed is an interposer which enables to prevent breaking of wiring pattern in an IC chip mounted on a package substrate. By arranging an interposer (70) between a package substrate (10) and an IC chip (110), there can be absorbed the stress due to the difference of thermal expansion coefficient between the multilayer printed wiring board (10) having a large thermal expansion coefficient and the IC chip (110) having a small thermal expansion coefficient. In particular, by using an insulating substrate (80) having a Young's modulus of 55-440 GPa as a component of the interposer (70), the stress can be absorbed in the interposer (70).