发明名称 |
Memory module has secondary memory chips mounted over one of primary memory chips electrically connected to conductive pattern, so that primary memory chip mounted below secondary memory chip is disabled |
摘要 |
The memory chips (107,109) are mounted over one of the memory chips (105) that are mounted on a substrate (101) and electrically connected to an external terminal through a conductive pattern (111), so that the memory chip (105) mounted below the memory chip (109) is disabled. |
申请公布号 |
DE102004042042(A1) |
申请公布日期 |
2005.03.31 |
申请号 |
DE20041042042 |
申请日期 |
2004.08.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, CHANG-HYUN;KIM, KYUNG-HO |
分类号 |
H01L23/12;G11C5/04;H01L21/66;H01L25/065 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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