发明名称 Memory module has secondary memory chips mounted over one of primary memory chips electrically connected to conductive pattern, so that primary memory chip mounted below secondary memory chip is disabled
摘要 The memory chips (107,109) are mounted over one of the memory chips (105) that are mounted on a substrate (101) and electrically connected to an external terminal through a conductive pattern (111), so that the memory chip (105) mounted below the memory chip (109) is disabled.
申请公布号 DE102004042042(A1) 申请公布日期 2005.03.31
申请号 DE20041042042 申请日期 2004.08.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, CHANG-HYUN;KIM, KYUNG-HO
分类号 H01L23/12;G11C5/04;H01L21/66;H01L25/065 主分类号 H01L23/12
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