| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing state monitoring device capable of easily grasping a progress of polishing. <P>SOLUTION: A polishing state monitoring device is provided for monitoring a progress of polishing of a surface to be polished by obtaining a characteristic value showing a state of the surface to be polished in each sampling point at intervals of a prescribed gap, during scanning the surface to be polished of a polishing object 12. The polishing state monitoring device comprises emitting means 21 capable of emitting light with which the surface to be polished is irradiated, calculating parts 22, 23, and 26 in which the reflected light from the surface to be polished is received and the characteristic value is generated, and the characteristic value is taken out from the sampling point of the same sampling timing and outputted for every scanning based on the characteristic value thus generated, and the development of polishing of the surface to be polished can be monitored according to a distance from a center of the surface to be polished. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
