| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the size and widen the band of an electronic component module of an integrally formed antenna type. <P>SOLUTION: The electronic component module is composed of a device-side module A and an antenna-side module B. The device-side module A is provided with a first dielectric substrate 11 wherein first transmission lines 11a are formed, and high-frequency devices 13 mounted on the first substrate 11 and connected to the first lines 11a. The antenna-side module B is provided with a second dielectric substrate 12 which is arranged in a lamination direction with respect to the first substrate 11 and wherein second transmission lines 12a connected electrically to the first lines 11a are formed, and antenna elements 14 which are provided on the second substrate 12 and perform the transmission or reception of signals to or from the high-frequency devices 13 via the second lines 12a and the first lines 11a. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
