| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of inexpensively manufacturing a wiring circuit board having high reliability. SOLUTION: The conductive layer 10b of a predetermined wiring pattern is formed on an insulating layer 10a. The solution of a photosensitive solder resist is applied on the insulating layer 10a including the conductive layer 10b of the predetermined pattern. The solution of the applied photosensitive solder resist is dried using a hot air circulation furnace or the like. Thereafter, a transparent protective film Fi is stacked on a photosensitive solder resist layer SR. For the formation of the conductive layer 10b on the insulating layer 10a, the application and drying of the solution of the photosensitive solder resist on the insulating layer 10a including the conductive layer 10b, and the stack of the transparent protective film Fi on the photosensitive solder resist layer SR they are attained by roll-to roll, for example. COPYRIGHT: (C)2005,JPO&NCIPI |
