发明名称 SHIELDING CASE
摘要 PROBLEM TO BE SOLVED: To obtain a shielding case whereby the soldering faults of S-surface mounting components, the increase in manual soldering works, and the like are prevented. SOLUTION: A shielding case 200 mounted on a printed wiring board 100 has an opening portion 201, formed out of a plurality of square holes and for injecting thereinto a moisture-proof coating agent 130, in the region corresponding to the upper-side region of an IC 101 required to be coated with the moisture-proof coating agent 130, when mounting it on the printed wiring board 100. Further, the shielding case 200 has a protrusive wall portion 202 for preventing the diffusion of the moisture-proof coating agent 130, in the peripheral edge of the region wider than the opening portion 201 of the shield case 200. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005086021(A) 申请公布日期 2005.03.31
申请号 JP20030317231 申请日期 2003.09.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 NAGATA KOICHIRO;NIWAYAMA MASANORI
分类号 H05K3/28;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K3/28
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