| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for drilling a wiring substrate, capable of suppressing the generation of burr in the case of forming a through hole in a recessed portion. SOLUTION: When the through hole 28 is formed in the recessed portion 64 of a resin thin plate 66 using a drill 78, an elastically flexible subsidiary sheet 72 is arranged between an entry sheet 68 and the resin thin plate 66. As a result, the drill 78 passed through the entry sheet 68 in a drilling process R6 is further lowered while pushing the subsidiary sheet 72 downward. Therefore, the subsidiary sheet 72 is brought into close contact with the bottom surface of the recessed portion 64 by being pushed with the drill 78. As a result, the through hole 28 is formed in a state that the bottom surface of the recessed portion 64 is pushed by the subsidiary sheet 72. COPYRIGHT: (C)2005,JPO&NCIPI
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