发明名称 Pattern formation method
摘要 A resist film is formed on a substrate, and pattern exposure is performed by selectively irradiating the resist film with exposing light. A first resist pattern is formed by developing the resist film after the pattern exposure, and subsequently, a water-soluble film including a crosslinking agent that crosslinks a material of the resist and an acid, that is, a crosslinkage accelerator for accelerating a crosslinking reaction of the crosslinking agent, is formed over the substrate including the first resist pattern. Thereafter, a crosslinking reaction is caused by annealing between a portion of the water-soluble film and a portion of the first resist pattern in contact with each other on the sidewall of the first resist pattern, and then, a portion of the water-soluble film not reacted with the first resist pattern is removed. Thus, a second resist pattern made of the first resist pattern and the water-soluble film remaining on the sidewall of the first resist pattern is formed.
申请公布号 US2005069814(A1) 申请公布日期 2005.03.31
申请号 US20040859121 申请日期 2004.06.03
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 ENDO MASAYUKI;SASAGO MASARU
分类号 G03F7/40;G03C5/00;G03F7/00;H01L21/027;(IPC1-7):G03C5/00 主分类号 G03F7/40
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