| 发明名称 |
Integrating thermoelectric elements into wafer for heat extraction |
| 摘要 |
An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.
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| 申请公布号 |
US2005067692(A1) |
申请公布日期 |
2005.03.31 |
| 申请号 |
US20030676585 |
申请日期 |
2003.09.30 |
| 申请人 |
RAMANATHAN SHRIRAM;CHRYSLER GREGORY M.;CHAU DAVID;LEI RYAN |
发明人 |
RAMANATHAN SHRIRAM;CHRYSLER GREGORY M.;CHAU DAVID;LEI RYAN |
| 分类号 |
H01L23/38;(IPC1-7):H01L21/44;H01L21/00;H01L23/34;H01L29/40 |
主分类号 |
H01L23/38 |
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