发明名称 |
SEMI-CONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION OF A SEMI-CONDUCTOR COMPONENT |
摘要 |
The invention relates to a semi-conductor component and to a method for the production thereof. The semi-conductor component comprises a substrate (3) whereon one or several semi-conductor chips (1, 2) are arranged and contacted. A structured conductor layer is applied to an insulating masking element (8) comprising through-openings (12) extending to connection points (19) on the substrate and/or semi-conductor chip (1). The conductor layer comprises integral projections extending through the through-openings (12) to the connection points (19). |
申请公布号 |
WO2004100259(A3) |
申请公布日期 |
2005.03.31 |
申请号 |
WO2004EP03376 |
申请日期 |
2004.03.31 |
申请人 |
EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH;INFINEON TECHNOLOGIES AG.;MAUDER, ANTON;GUTSMANN, BERND |
发明人 |
MAUDER, ANTON;GUTSMANN, BERND |
分类号 |
H01L21/60;H01L23/373;H01L25/065 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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