发明名称 SEMI-CONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION OF A SEMI-CONDUCTOR COMPONENT
摘要 The invention relates to a semi-conductor component and to a method for the production thereof. The semi-conductor component comprises a substrate (3) whereon one or several semi-conductor chips (1, 2) are arranged and contacted. A structured conductor layer is applied to an insulating masking element (8) comprising through-openings (12) extending to connection points (19) on the substrate and/or semi-conductor chip (1). The conductor layer comprises integral projections extending through the through-openings (12) to the connection points (19).
申请公布号 WO2004100259(A3) 申请公布日期 2005.03.31
申请号 WO2004EP03376 申请日期 2004.03.31
申请人 EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH;INFINEON TECHNOLOGIES AG.;MAUDER, ANTON;GUTSMANN, BERND 发明人 MAUDER, ANTON;GUTSMANN, BERND
分类号 H01L21/60;H01L23/373;H01L25/065 主分类号 H01L21/60
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