A PACKAGE MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE DEVICE

摘要

A method for manufacturing the package of a surface acoustic wave device is provided to improve the degree of shielding by implementing the protection structure of surface acoustic wave device chip. A method for manufacturing the package of a surface acoustic wave device includes the steps of: preparing a plurality of surface acoustic wave device chips having a plurality of bump balls on the input/output electrodes; preparing the substrate(32) with a preset size; flip bonding the plurality of surface acoustic wave device chips prepared on the substrate(32) at a preset distance; laminating the plurality of surface acoustic wave device chips and the semi-solid film(33) on the substrate(32); solidifying the laminated film(34); and cutting the substrate(32) laminated with the film(34) into a plurality of columns and rows with reference to the each bonded surface acoustic wave device chips.