| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic material and an electronic component which require higher machining precision than heretofore in the high frequency use of the millimeter wave range that the length of the component is about the wavelength size and whose thermal expansion coefficient is almost zero, and to provide an electronic material or a structural material whose thermal expansion coefficient is controlled to be matched with the other material. <P>SOLUTION: A zero thermal expansion coefficient or a material whose thermal expansion coefficient is almost zero is manufactured by using a material wherein a ceramic particle has a crystal structure having the thermal expansion coefficient different between the inside part and the outside part, for example, a material wherein the inside part has positive thermal expansion coefficient and the outside part has zero or negative thermal expansion coefficient or a material wherein the outside part has positive thermal expansion coefficient and the inside part has zero or negative thermal expansion coefficient and controlling the the quantity of the material. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
