SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element, a semiconductor device, a manufacturing method of the semiconductor element, a manufacturing method of the semiconductor device and an electronic device capable of reducing the short-circuiting of a wiring and an increase of parasitic capacity with regard to the thin film device while keeping manufacturing costs low if the thin film device (the semiconductor device) is constructed by affixing micro tile-shaped devices onto a substrate.

SOLUTION: In the semiconductor element 20 that is micro tile-shaped by separating the semiconductor element 20 formed on the substrate from the substrate, the semiconductor device has a tile section 21a having the tile shape and an insulating layer 23 which is an insulating member which insulates an electrode section formed at the tile section 21a from a desired member and at least a part of the insulating member protrudes from the external edge of the tile section 21a.

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