| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To mount an electronic part at a high yield by supplying solder to a substrate for mounting an electronic part that is provided with a non-flat mounting surface, in high controllability and at a high speed. <P>SOLUTION: The mounting method is used to mount a bare chip 20 as an electronic part for example, on a printed wiring board 10a as a substrate for mounting an electronic part whose mounting surface is non-flat. The method includes a step to a solder bump 3 on an electrode pad 12 by dropping a melted solder on the electrode pad 12 formed on the mounting surface; a step to place the bare chip 20 on the printed wiring board 10a with the solder bump 3 in between according to the layout of the electrode pad 12; and a step to melt the solder bump 3 once, to solidify it thereafter, and to electrically connect the bare chip 20 and the electrode pad 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
