Surface acoustic wave element and method for fabricating semiconductor device

摘要

A template 3 manufactured to have high-accuracy protrusions and recesses in advance by a lithography technology employing an electron beam is pressed against a resist film 2 applied onto a substrate 1 thus transferring a resist pattern 5. A thin metal film 6 foe electrode s then formed on the resist pattern 5 formed by transfer and then it is stripped off by a lift-off method along with the resist film 2.