| 摘要 |
The present invention is a means for forming substrates for the fabrication of active devices using topography based lithographic manufacturing techniques. A form is used to create a substrate by injection molding, embossing, or by other means of applying a topography to the substrate using a form. This substrate can be plastic, glass or other moldable material or a moldable material layer on another material, but is typically an insulating material that will not participate in the operation of the end devices. The present invention is a means for creating such a form. Furthermore, the present invention is also a means for molding the backside of said substrate, either simultaneously or in multiple steps, such that active devices or portions of a given active device can be formed on both front and back sides of the substrate. The present invention includes means for interconnecting components on both sides of the substrate. This invention will find application to the forming of substrates for the purpose of fabricating memory devices having preprogrammed content (i.e., factory Programmed Read Only Memory, PROM) and includes means for adding such content at a later point in the process to create such a form for economic advantage. Finally, the present invention includes means for making such a memory device as a removable and interchangeable component for insertion into industry standard or proprietary form factors (e.g., a CompactFlash(TM) card) or other adapting devices (e.g., a GPS card) whereby the particular form factor would act as a carrier device into which the memory device is inserted and then the carrier device is plugged into an accessing device (e.g., a music or media player, a computing device, or the like). Alternatively, the adapting mechanism could be a permanent part of the accessing device.
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