METHOD FOR MANUFACTURING THROUGH HOLE ELECTRODE FOR WAFER

摘要

A method of manufacturing a through-hole electrode on a wafer is provided to acquire a high degree of via integration in comparison with an existing PCB(Printed Circuit Board) by forming a through-hole on the substrate and filling the through-hole by an electroplating method. One or more through-hole is formed on a substrate. An electroplating electrode is formed on an upper surface of one side of the substrate. A penetrating electrode(14) is formed by filling the through-hole with a conductor by using the electroplating electrode(14). A metal material except for the penetrating electrode(14) is removed therefrom.