| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a wafer to be surely arranged at the center of a holding plate of a polishing apparatus. <P>SOLUTION: The transferred wafer 21 is sucked and fixed by a wafer suction unit 26 provided on the tip of a loading arm 24. The wafer 21 is positioned and arranged by a positioning mechanism 31 on the holding plate 12 which is smaller in diameter than the wafer and provided on the work platen 11 of the polishing apparatus 10 in a rotatable manner. The positioning mechanism 31 is equipped with a bracket 27 which is provided to the tip of the loading arm 24 so as to be parallel with the holding plate 12, two or more positioning arms 32 which are provided so as to move back/forward in a radial direction from the center of the bracket 27, an actuator 33 which moves the positioning arms 32 back/forward, and wafer positioning jigs 36 provided to the positioning arms 32, respectively. While the positioning arms 32 are moved back, the wafer positioning jigs 36 are brought into contact with the circumferential faces of the wafer 21 and the holding plate 12 simultaneously so as to set the wafer 21 and the holding plate 12 concentric with each other. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
