| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic parts capable of certainly suppressing the generation / growth of whiskers from an exterior package plating portion under a real usage environment, while forming a simple structured metal thin film consisting of Sn or Sn system alloy of Pb free on the front surface of a reed base material as exterior package plating of external terminals of electronic parts. <P>SOLUTION: The external terminals of the electronic parts are provided with a reed base material 1 and a metal thin film 2 coating a front surface of the reed base material 1. An average crystal size index defined on the basis of a capacity of a crystal grain in the direction perpendicular or parallel to a front surface of the base material of an individual crystal grain of a cross section which appears at the time of cutting the metal thin film 2 by an arbitrary cut surface perpendicular to the front surface of the reed base material 1, is set seven or more. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
