发明名称 METHOD OF MANUFACTURING SHEET WITH NON-CONTACT IC TAG
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a sheet with a non-contact IC tag, which allows an IC chip to be easily positioned and mounted on an antenna circuit. <P>SOLUTION: A non-conductor sheet 25 is supplied and laminated on one band-shaped conductor 14a. Next, an IC chip 20 having an electrode 21 having a pointed end on one surface and having a flat electrode 22 on the other surface is mounted on the non-conductor sheet 25 so as to have one electrode 21 faced to the non-conductor sheet 25, and the other band-shaped conductor 14b is supplied and laminated on the non-conductor sheet 25. The electrode 21 having the pointed end is caused to penetrate the non-conductor sheet 25 and is connected to one band-shaped conductor 14a, and the flat electrode 22 is connected to the other band-shaped conductor 14b, and a sheet body 10 is formed with one band-shaped conductor 14a, the non-conductor sheet 25, the IC chip 20, and the other band-shaped conductor 14b. The sheet body 10 is cut for each IC chip 20 to obtain a sheet 1 with a non-contact IC tag. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005085223(A) 申请公布日期 2005.03.31
申请号 JP20030319853 申请日期 2003.09.11
申请人 DAINIPPON PRINTING CO LTD 发明人 SAKATA HIDETO
分类号 B42D15/10;G06K19/07;G06K19/077 主分类号 B42D15/10
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