| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC packaged body, capable of further improving its performance than heretofore and drastically reducing its manufacturing cost. <P>SOLUTION: This IC packaged body is provided with an IC chip 4; an antenna circuit 5 electrically connected to the IC chip and equipped with two terminal parts 5a and 5b for providing an electrically non-connecting part X in the middle; and electrical conductive layers 2 provided at the position facing the two terminal parts 5a and 5b of the antenna circuit with insulating layer members 7 and 8 between. The two terminal parts 5a and 5b are allowed to face a part of the electrical conductive layers 2 respectively with the insulating member between, that is, by making the two terminal parts 5a and 5b superimposed, they are electrostatically coupled together, even though the electrically non-connecting part X, thereby constituting the the antenna circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
