| 摘要 |
PROBLEM TO BE SOLVED: To efficiently suppress deterioration in microphone sensitivity due to gating of charges from an electret layer by minimizing the gas generating quantity from an adhesive, even if an electret condenser microphone as a finished product is exposed to a high temperature environment, in a method of manufacturing an electret condenser microphone having a bonding portion. SOLUTION: A diaphragm film 34A is stretched and fixed on a supporting ring 34B by adhesive fixing using a reaction-curing type adhesive A1. In this way, the gas generating quantity from the adhesive is largely reduced compared to a case of using a volatile curing type adhesive etc. Also, heating process of not less than an hour at 200-230°C is applied to a diaphragm film sub-assembly 34 before being housed in a metal cover 32. In this way, the gas generation from the adhesive A1 is urged in advance after completely preventing the influence on an electret layer 38B of a back electrode plate 38. COPYRIGHT: (C)2005,JPO&NCIPI
|
