| 发明名称 |
System and method for mounting processor and heat transfer mechanism |
| 摘要 |
A heat sink having a base structure with a protruding thermal interface having an arcuate surface adapted to contact a processor assembly. The arcuate surface is adapted to accommodate a bent configuration of the base structure induced by a mounting load applied to the base structure.
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| 申请公布号 |
US2005068741(A1) |
申请公布日期 |
2005.03.31 |
| 申请号 |
US20030674011 |
申请日期 |
2003.09.29 |
| 申请人 |
BAILEY DOUGLAS A.;PALMER NICHOLAS J.;MARTINO PETER M. |
发明人 |
BAILEY DOUGLAS A.;PALMER NICHOLAS J.;MARTINO PETER M. |
| 分类号 |
H01L23/40;H01L23/433;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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