发明名称 |
Method and apparatus for a dual substrate package |
摘要 |
A semiconductor die having a through via formed therein is disclosed. A first conductive layer is formed on the front side of the die and a second conductive layer is formed on the backside of the die, and coupled with the through via. A first package substrate is electrically coupled with the first conductive layer, and a second package substrate is electrically coupled with the second conductive layer. In another embodiment, a substrate ball electrically couples the first and second package substrates. In a further embodiment, a flip chip bump is attached to the first package substrate.
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申请公布号 |
US2005067714(A1) |
申请公布日期 |
2005.03.31 |
申请号 |
US20030676883 |
申请日期 |
2003.09.30 |
申请人 |
RUMER CHRISTOPHER L.;SINGH KULJEET |
发明人 |
RUMER CHRISTOPHER L.;SINGH KULJEET |
分类号 |
H01L21/768;H01L23/055;H01L23/48;H01L23/498;(IPC1-7):H01L21/48;H01L29/40 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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