发明名称 |
VORRICHTUNG UND VEFAHREN FÜR DAS KONTROLLIERTE POLIEREN UND PLANARISIEREN VON HALBLEITERSCHLEIFEN |
摘要 |
<p>A system and method for polishing semiconductor wafers includes a rotatable polishing pad movably positionable in a plurality of partially overlapping configurations with respect to a semiconductor wafer. A pad dressing assembly positioned coplanar, and adjacent, to the wafer provides in-situ pad conditioning to a portion of the polishing pad not in contact with the wafer. The method includes the step of radially moving the polishing pad with respect to the wafer.</p> |
申请公布号 |
DE60102891(T2) |
申请公布日期 |
2005.03.31 |
申请号 |
DE2001602891T |
申请日期 |
2001.01.12 |
申请人 |
LAM RESEARCH CORP., FREMONT |
发明人 |
KISTLER, ROD;GOTKIS, YEHIEL |
分类号 |
B24B37/26;B24B49/04;B24B51/00;B24B53/007;B24B53/017;H01L21/304;(IPC1-7):B24B37/04;B24B47/10;B24B53/02;B24D7/14 |
主分类号 |
B24B37/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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