| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive element using a protective film which has properties equivalent to those of a conventional polyolefin-base protective film and does not put too much load on the environment, and to provide a resist pattern forming method and a method for manufacturing a printed wiring board. <P>SOLUTION: The photosensitive element comprises a support film, a photosensitive resin composition layer located on the support film, and a protective film located on the photosensitive resin composition layer, wherein the protective film has a thickness of 5-30 μm and is based on a polylactic acid which is a biodegradable polymer. The resist pattern forming method and the method for manufacturing a printed wiring board use the photosensitive element. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
