| 摘要 |
PROBLEM TO BE SOLVED: To improve the strength of a root portion of a bump in an electrode structure using a bump, wherein a mating member is connected through soldering by means of a bump formed on a substrate. SOLUTION: The electrode structure using a bump is provided with a substrate 10, a base wiring 20 provided on one plane of the substrate 10, an underbump metal 40 provided on the base wiring 20, a metallic bump 50 that is provided on the underbump metal 40 and projects over one plane of the substrate 10, and a solder 60 provided on the bump 50. It is connected with a mating member by means of the solder 60. The solder 60 contains an Sn of 60 wt% or higher, and the solder 60 is not in contact with the base wiring 20 and the underbump metal 40. COPYRIGHT: (C)2005,JPO&NCIPI
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