| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable conductive paste which is provided with thermal conductivity and electric conductivity comparable to those of a solder, and in which a semiconductor characteristic is not deteriorated even in a high temperature solder re-flow process. SOLUTION: This is a resin paste for a semiconductor containing in a material 5 wt% or more of resin beads of the average particle size of 1.0 to 50μm in which (A) a thermosetting resin, (B) a curing agent, and (C) a filler are made as essential components, and in which a metal plating is applied on the filler surface. As a more preferable embodiment, the thermosetting resin is the conductive paste composed of at least one kind of resin selected from an epoxy resin or an acrylic resin which is in a liquid state at room temperatures, and more preferably the conductive resin paste in which the plating metal on the surface of the resisn beads is selected from gold, silver, copper, or nickel, and in which the fillers other than the metal-plated resin beads are at least not less than one kind selected from silver, copper, or nickel. COPYRIGHT: (C)2005,JPO&NCIPI
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