发明名称 |
Stencil and apparatus for supporting and tensioning the stencil |
摘要 |
A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.
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申请公布号 |
US2005066827(A1) |
申请公布日期 |
2005.03.31 |
申请号 |
US20040998863 |
申请日期 |
2004.11.29 |
申请人 |
WILLIAMS DAVID GODFREY |
发明人 |
WILLIAMS DAVID GODFREY |
分类号 |
B05C17/06;B41F15/36;H05K3/12;(IPC1-7):B41M1/12 |
主分类号 |
B05C17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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