TRANSMITTING MODULE WITH IMPROVED HEAT DISSIPATION

摘要

A transmitting module for mobile radio applications comprises a multilayered module substrate, which has metallization levels (MS) and dielectric layers located therebetween, and a circuit is realized inside said substrate by structuring the metallization levels. At least one high-frequency filter (S) or matching network is realized in or on the module substrate. A recess (CA) is provided on the underside of the module substrate, and a chip component (PA) is soldered into said recess in a flip-chip configuration. The outwardly pointing back of the chip component comprises a metallization (M) that enables a good thermal contact of the chip component with the outer surroundings of the circuit.