Substrate or carrier for a wafer for semiconductor technology and manufacturing microelectronic circuits having two insulated activation electrodes

摘要

The carrier for a wafer (110) has a substrate (110) on one side of which the wafer (120) is to be applied. First (116) and second (118) electrodes are also arranged on this side of the substrate and are insulated from each other. First (112) and second (114) activation electrodes are arranged on the other side of the substrate and are electrically insulated from each other. A first coupling device (122) electrically couples the first activation electrode to the first electrode (116). A second coupling device (124) electrically couples the second activation electrode to the second electrode (118). The first and second coupling devices are electrically insulated from each other. A region of insulation (126) is formed to insulate or isolate the first and second activation electrodes from the surrounding of the carrier. Independent claims also cover methods of making a carrier and handling a wafer.