Fine pitch ball grid array device for face-down integrated circuit chips has balls of solder on underside in contact with through-connectors under copper layer and chip

摘要

The FBGA (fine pitch ball grid array) connection device (5) is for face-down integrated circuit chips (6). It has balls of solder (14) acting as electrical contacts on the underside of the chip. The balls are in contact with through-connectors (13) under a copper layer (18) and the chip. The connectors extend through two substrate plates (1,2). A central bonding channel extends through holes in the substrate. It consists of a stepped diameter cast mass of insulating material (16) containing bridging wires (10). The chip is encapsulated in a molding compound (17).