| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning evaluation method of a substrate which is capable of evaluating the cleanness of the surface of the substrate with high accuracy. SOLUTION: The substrate-cleaning evaluation method is a method of evaluating the surface cleanness of the substrate, whose surface is cleaned after polishing. The method include steps where: a dummy substrate D1 where a metal film is formed on its surface and a monitoring substrate M serving as a target for cleaning evaluation are prepared; the dummy substrate D1 is polished; the monitoring substrate M is polished without dressing the polishing plane 10 of a polishing table 11; after the dummy substrate D1 is polished, the polished monitoring substrate M is cleaned; and then the cleanliness of the cleaned surface of the monitoring substrate M is evaluated. COPYRIGHT: (C)2005,JPO&NCIPI |
