| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling unit used for cooling a semiconductor laser or the like, which is improved in mechanical strength and reduced in the pressure loss of a cooling liquid. SOLUTION: The cooling device 1 has flow paths formed of grooves 14 divided by ridges 13, 30, and 32, and penetration parts 17 divided by overhangs 15 and 33 and separating strips 16, 18, 31, and 34 including cooling liquid supply/exhaust openings on the plate-like members 2 to 4. The ridges, the overhangs, and the separating strips of one of the plate-like members are bonded to those of the other plate-like member, and the plate-like members are improved in bonding strength. The ridges, overhangs 15, and separating strips are provided to the different two plate-like members at the same positions, whereby the plate-like members can be more improved in bonding strength. When the plate-like member equipped with a solder layer on its surface is stacked up, a large number of fine hollows 12 are provided to the bonding surface of the plate-like member where the flow paths are not provided on its surfaces so as to form solder fillets on all the bonding surface for enhancing a bonding strength. The grooves 14 and the penetration parts 17 can be formed by chemical etching at the same time when the external shape of the plate-like member is formed, and two or more of the plate-like members can be produced simultaneously from the same plate. COPYRIGHT: (C)2005,JPO&NCIPI |
