| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing three-dimensional device by which the electrical and mechanical connections between thin film devices can be performed simultaneously. SOLUTION: The method of manufacturing three-dimensional device includes a step of forming an isolation layer 102 on a substrate 101, a step of forming a device layer 103 on the isolation layer 102, and a step of forming an insulating layer 104 on the device layer 103. The method also includes a step of forming connection electrodes 106 electrically connected to the inside of the device layer 103, a step of forming an insulating layer 202 on another device layer 201, and a step of forming connection electrodes 203. In addition, the method also includes a step of joining the device layers 103 and 201 to each other, and a step of peeling the substrate 101 from the device layer 103 by projecting XeCl excimer laser light from the substrate 101 side. COPYRIGHT: (C)2005,JPO&NCIPI
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