| 摘要 |
PROBLEM TO BE SOLVED: To form a circuit pattern capable of forming a plating film with a predetermined thickness even in a minute circuit pattern and, further, excellent in the adhesiveness of the film by utilizing an electroless plating method. SOLUTION: A photoresist film 2 comprising optical catalyst powder is arranged on a substrate 1 to expose and develop through a mask 3 whereby a pattern film 2' with a penetrating part 20 having a punched predetermined pattern is formed to deposit the electroless plating film 4 in the penetrating part 20. The vertical wall surfaces 21 of both sides of the penetrating part 20 are activated and, therefore, the electroless plating film 4 is also deposited on the vertical wall surfaces 21. COPYRIGHT: (C)2005,JPO&NCIPI
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