发明名称 Vacuum deposition method and vacuum deposition device
摘要 The vacuum deposition device includes a vacuum deposition chamber, a vacuum evacuator for evacuating an inside of the chamber, at least one first evaporator which evaporates a first film forming, at least one second evaporator which evaporates a second film forming material. One of the first and second evaporators which is closer to the substrate is spaced apart from the substrate in a vertical direction by 100 to 300 mm. The substrate, the first evaporator and the second evaporator are installed at positions, which satisfy a condition of an expression (1): 0.3<=L1/L2<=50. L1 is a distance in a vertical direction from a horizontal plane of a first or second evaporation port of the first or second evaporator to a surface of the substrate, and L2 is the shortest distance between the first evaporation port and the second evaporation port.
申请公布号 US2005066901(A1) 申请公布日期 2005.03.31
申请号 US20040952854 申请日期 2004.09.30
申请人 FUJI PHOTO FILM CO., LTD. 发明人 ISODA YUJI
分类号 G21K4/00;C09K11/77;C23C14/06;C23C14/24;C23C14/50;C23C14/54;(IPC1-7):C23C16/00 主分类号 G21K4/00
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