发明名称 Memory module for computer system, includes buffer for buffering signal for memory chips, which is placed on circuit boards
摘要 <p>The inner faces (32,54) and outer faces (34,52) of circuit boards (30,50) support memory chips (56,58). The electrical connector (60) connects circuit boards. The buffer (38) is placed on circuit board (30), buffers signal for memory chips. An independent claim is also included for memory structure.</p>
申请公布号 DE102004039806(A1) 申请公布日期 2005.03.31
申请号 DE20041039806 申请日期 2004.08.11
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SO, BYUNG-SE;CHO, JEONG-HYEON;LEE, JUNG-JOON;LEE, JAE-JUN
分类号 G06F12/00;G11C5/06;G11C7/10;G11C8/06;H05K1/14;H05K1/18;(IPC1-7):G11C5/06 主分类号 G06F12/00
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