发明名称 DISCHARGE PLASMA PROCESSING METHOD, AND DISCHARGE PLASMA PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a discharge plasma processing method and a discharge plasma processing device capable of prolonging the life of an electrode constructing a discharge space, and preventing the malfunction of an electric circuit impressing a discharge processing voltage between the electrodes. <P>SOLUTION: The discharge plasma processing device has a pair of electrodes 11, 12 facing each other, with at least one of the opposing surfaces of the electrodes covered by solid dielectrics 13, 14. On the discharge plasma processing method, applying a plasma treatment on an object to be treated 19 located between the electrodes 11, 12, by impressing a discharge processing voltage and generating discharge between the electrodes to generate a plasma; a discharge preparation voltage VL lower than the discharge processing voltage lowered by a controller 27 is impressed between the electrodes as a preceding process and/or a post process in which the discharge processing voltage VH is impressed from a state that voltage is not impressed between the electrodes. The discharge preparation voltage VL is set at 10 to 99.9% of the discharge processing voltage VH. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005085586(A) 申请公布日期 2005.03.31
申请号 JP20030315932 申请日期 2003.09.08
申请人 SEKISUI CHEM CO LTD 发明人 IWANE KAZUYOSHI
分类号 H05H1/46;B01J19/08;C23C16/515 主分类号 H05H1/46
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