| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To machine a secondary patterning line at high speed by accurately emitting a laser beam on the basis of a primary patterning line formed on a substrate. <P>SOLUTION: With a workpiece arranged on an image pickup processing stage 10, the image of a surface to be machined is picked up with an image unit 11. On the basis of the image pickup signal, an image processing unit 31 calculates the positional coordinate values of a plurality of points on the primary patterning line that is already formed on the surface to be machined. Subsequently, with the workpiece arranged on a machining stage 20, a position on the primary patterning line corresponding to part of the extracted position of the above positional coordinate values is picked up in image with image units 21, 22 to determine the coordinates. Then, a laser beam scanning position is corrected in accordance with the difference from the positional coordinate values, and the workpiece is irradiated by the laser beam by controlling the operation of a galvano scanning mirror 25 or the like. Thus, the secondary patterning line is formed on the surface to be machined. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
