| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To decrease disconnection defects by eliminating the poor adhesive strength of wiring or electrodes caused by the contamination of the substrate surface on which a film is to be deposited in manufacturing a TFT-array substrate for a liquid-crystal display device. <P>SOLUTION: The manufacturing of the TFT-array substrate includes five steps of (A) to (E) with five photolithography processes. In a second cleaning step, cleaning is performed on a surface on which a film is to be deposited before depositing a second metal thin film that forms source electrodes 8, source wiring 9, and drain electrodes 10. In this second cleaning step, cleaning using a TMAH solution is performed as a removing treatment for removing contaminants which adhere on the surface on which a film is to be deposited and which contain fluorine-based reaction products such as silicon fluorides or metal fluorides. Thereby, the adhesive strength between the underlying film (gate insulating film 5) and the second metal thin film (Cr) is enhanced. As a consequence, the disconnection defects caused by the poor adhesive strength between the underlying film and the electrodes or wiring composed of the second metal thin film decrease, and it is possible to manufacture a liquid-crystal display device of excellent display quality and high reliability with a high yield. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
