SEMICONDUCTOR CHIP SEPARATOR, SEMICONDUCTOR CHIP SEPARATING METHOD, AND SEMICONDUCTOR CHIP FEEDING APPARATUS

摘要

PROBLEM TO BE SOLVED: To separate thinned semiconductor chips without damaging them when separating them from a pressure sensitive adhesive sheet to which the plurality of semiconductor chips formed by dicing a semiconductor wafer are pasted and held. SOLUTION: While holding by sucking the pressure sensitive adhesive sheet 3 near the periphery of a bottom-side region thereof corresponding to a region to which the semiconductor chip 1 is pasted, a plurality of projections 30 of a separation member 21 are abutted against the bottom face of the semiconductor chip 1 via the pressure sensitive adhesive sheet 3 in the semiconductor chip pasting region. The pressure sensitive adhesive sheet 3 is sucked by parts between the projections 30 to turn face bonding formed by pasting the semiconductor chip 1 to the pressure sensitive adhesive sheet 3 to point bonding. Furthermore, by moving the separation member 21 along the bottom face of the semiconductor chip 1, point bonding positions are changed and thereby the adhesion to the pressure sensitive adhesive sheet 3 by pasting the semiconductor chip 1 to the pressure sensitive adhesive sheet 3 is reduced, and then the semiconductor chip is separated from the pressure sensitive adhesive sheet 3. COPYRIGHT: (C)2005,JPO&NCIPI