HARD THICK FILM, AND METHOD FOR FORMING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a hard film which can mitigate internal stresses sufficiently even when the thickness is≥10μm, or≥5μm up to several hundredsμm in the case of a TiN film, and can be formed even by a method such as an ion-plating method in which a raw material of the film is limited. SOLUTION: Internal stresses are reduced and peeling is suppressed by a hard thick film of a structure in which a stress mitigating layer by a metal layer is placed in a metal nitride film with a predetermined thickness at a predetermined interval. The hard thick film is formed by repeating a step A: of forming the metal nitride layer for a predetermined time, and a step B: of forming a metal layer for a predetermined time. COPYRIGHT: (C)2005,JPO&NCIPI