| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant resin composition which does not use 4,4-diaminodiphenylmethane affecting environments as a curing agent, has good curing characteristics, and gives cured products having high heat resistance, good adhesiveness and good mechanical characteristics. SOLUTION: This heat-resistant resin composition is characterized by containing (A) (a) an aminophenol compound having an amino group and a phenolic hydroxy group in the molecule and (b) a bismaleimide compound represented by the chemical formula (1) (R<SP>1</SP>is a divalent group containing at least two carbon atoms), (B) an epoxy resin, and (C) a polyimide resin represented by the chemical formula (2) [R<SP>2</SP>is a divalent group containing at least two carbon atoms; (n) is an integer of≥1] as essential components. COPYRIGHT: (C)2005,JPO&NCIPI
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